Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing: Original scientific paper. Journal of Electrochemical Science and Engineering, [S. l.], v. 14, n. 2, p. 265–273, 2024. DOI: 10.5599/jese.2291. Disponível em: https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291. Acesso em: 10 dec. 2025.