Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing
Original scientific paper
DOI:
https://doi.org/10.5599/jese.2291Keywords:
Additive manufacturing, copper electroplating, slicing, profilometry
Abstract
The local deposition process from copper sulfate electrolyte was investigated depending on nozzle moving speed and additive concentration in the electrolyte. A 2×2 cm square model was created and sliced in Ultimaker Cura software, uploaded in a 3D printer, and printed from the copper electrolyte on the stainless-steel surface. Low additive concentration in the electrolyte was found to influence dendrite formation in the corner sections of a square model. Nozzle movement speed was found to influence the deposition area and the thickness of the metal. The lowest tested nozzle movement speed of 5 s / voxel increased the deposition area by nearly 40 % in horizontal direction compared to 2.5 s / voxel. Further increase of nozzle movement speed to 1.6 s / voxel does not change the deposition area. The thickness in the corners increases by 2.5 times compared to the straight section of the square when the nozzle movement speed increases from 5 to 1.6 s / voxel. The non-uniform thickness of the deposited metal is caused by a considerable reduction of nozzle movement speed when it moves through the corner. The results obtained in this work can be further used to develop electrochemical 3D printing technology.
Downloads
References
I. Gibson, D. Rosen, B. Stucker, Additive Manufacturing Technologies, Springer, New York, USA, 2010, p. 472. https://doi.org/10.1007/978-1-4419-1120-9
A. Serajuddin, Challenges, current status and emerging strategies in the development of rapidly dissolving FDM 3D-printed tablets: An overview and commentary, ADMET and DMPK 11 (2023) 33-55. https://doi.org/10.5599/admet.1622
W. E. Frazier, Metal additive manufacturing: a review, Journal of Materials Engineering and Performance 23 (2014) 1917-1928. https://doi.org/10.1007/s11665-014-0958-z
D. Herzog, V. Seyda, E. Wycisk, C. Emmelmann, Additive manufacturing of metals, Acta Materialia 117 (2016) 371-392. https://doi.org/10.1016/j.actamat.2016.07.019
X. Li, P. Ming, S. Ao, W. Wang, Review of additive electrochemical micro-manufacturing technology, International Journal of Machine Tools and Manufacture 173 (2022) 103848. https://doi.org/10.1016/j.ijmachtools.2021.103848
G. Ercolano, T. Zambelli, C. van Nisselroy, D. Momotenko, J. Vörös, T. Merle, W.W. Koelmans Multiscale additive manufacturing of metal microstructures, Advanced Engineering Materials 22 (2020) 1900961. https://doi.org/10.1002/adem.201900961
L. Hirt, R.R. Grüter, T. Berthelot, R. Cornut, J. Vörös, T. Zambelli, Local surface modification via confined electrochemical deposition with FluidFM, RSC Advances 103 (2015) 84517-84522. https://doi.org/10.1039/c5ra07239e
W. Ren, J. Xu, Z. Lian, P. Yu, H. Yu, Modeling and experimental study of the localized electrochemical micro additive manufacturing technology based on the fluidFM. Materials 13 (2020) 2783. https://doi.org/10.3390/ma13122783
G. Ercolano, C. van Nisselroy, T. Merle, J. Vörös, D. Momotenko, W. W. Koelmans, T. Zambelli Additive manufacturing of sub-micron to sub-mm metal structures with hollow AFM cantilevers, Micromachines 11 (2020) 6. https://doi.org/10.3390/mi11010006
W. Ren, J. Xu, Z. Lian, X. Sun, Z. Xu, H. Yu, Localized electrodeposition micro additive manufacturing of pure copper microstructures, International Journal of Extreme Manufacturing 4 (2021) 015101. https://doi.org/10.1088/2631-7990/ac3963
A. Ambrosi, R. D. Webster, M. Pumera, Electrochemically driven multi-material 3D-printing. Applied Materials Today 18 (2020) 100530. https://doi.org/10.1016/j.apmt.2019.100530
S. Burlison, M. Minary-Jolandan, Multiphysics simulation of microscale copper printing by confined electrodeposition using a nozzle array, Journal of Applied Physics 131 (2022) 055303. https://doi.org/10.1063/5.0072183
Y. Guo, P. Liu, P. Jiang, Y. Hua, K. Shi, H. Zheng, Y. Yang, A flow-rate-controlled double-nozzles approach for electrochemical additive manufacturing. Virtual and Physical Prototyping 17 (2022) 52-68. https://doi.org/10.1080/17452759.2021.1989751
X. Chen, X. Liu, P. Childs, N. Brandon, B. Wu, A low cost desktop electrochemical metal 3D printer, Advanced Materials Technologies 10 (2017) 1700148. https://doi.org/10.1002/admt.201700148
F. Zhang, D. Li, W. Rong, L. Yang, Y. Zhang, Study of microscale meniscus confined electrodeposition based on COMSOL, Micromachines 12 (2021) 1591. https://doi.org/10.3390/mi12121591
X. Chen, X. Liu, M. Ouyang, J. Chen, O. Taiwo, Y. Xia, P. Childs, N.P. Brandon, B. Wu, Multi-metal 4D printing with a desktop electrochemical 3D printer, Scientific Reports 9 (2019) 3973. https://doi.org/10.1038/s41598-019-40774-5
S.J. Dover, A.E.W. Rennie, G.R. Bennett, Rapid Prototyping Using Electrodeposition of Copper, Solid Freeform Fabric Symposium, 1996, pp. 191-198. http://hdl.handle.net/2152/69936
H. Fan, Y.P. Zhao, S.K. Wang, Technical study of Jet electrodeposition in manufacture of metal parts, Key Engineering Materials 667 (2016) 259-264. https://doi.org/10.4028/www.scientific.net/KEM.667.259
C. Wang, L.D. Shen, M.B. Qiu, Z.J. Tian, W. Jiang, Characterizations of Ni-CeO2 nanocomposite coating by interlaced jet electrodeposition, Journal of Alloys and Compounds 727 (2017) 269-277. https://doi.org/10.1016/j.jallcom.2017.08.105
E. M. El‐Giar, R. A. Said, G. E. Bridges, D. J. Thomson, Localized electrochemical deposition of copper microstructures, Journal of The Electrochemical Society 147 (2000) 586-591. https://doi.org/10.1149/1.1393237
C. Y. Lee, C. S. Lin, B. R. Lin, Localized electrochemical deposition process improvement by using different anodes and deposition directions, Journal of Micromechanics and Microengineering 18 (2008) 105008. https://doi.org/10.1088/0960-1317/18/10/105008
J. C. Lin, T. K. Chang, J. H. Yang, Y. S. Chen, C. L. Chuang, Localized electrochemical deposition of micrometer copper columns by pulse plating, Electrochimica Acta 55 (2010) 1888-1894. https://doi.org/10.1016/j.electacta.2009.11.002
G. Vasyliev, V. Vorobyova, D. Uschapovskiy, O. Linyucheva, Local electrochemical deposition of copper from sulfate solution, Journal of Electrochemical Science and Engineering 12 (2022) 557-563. http://dx.doi.org/10.5599/jese.1352
G. Vasyliev, V. Vorobyova, D. Uschapovskiy, O. Linyucheva, Influence of polarization curve slope on the accuracy of local copper electrodeposition from sulphate electrolyte, Journal of Electrochemical Science and Engineering 6 (2023) 971-980. https://doi.org/10.5599/jese.1899
Downloads
Published
How to Cite
Issue
Section
License
Articles are published under the terms and conditions of the
Creative Commons Attribution license 4.0 International.
Funding data
-
Ministry of Education and Science of Ukraine
Grant numbers 0122U001523
