BABCHUK, R.; USCHAPOVSKIY, D.; VOROBYOVA, V.; LINYUCHEVA, O.; KOTYK, M.; VASYLIEV, G. Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing: Original scientific paper. Journal of Electrochemical Science and Engineering, [S. l.], v. 14, n. 2, p. 265–273, 2024. DOI: 10.5599/jese.2291. Disponível em: https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291. Acesso em: 25 jan. 2025.