Pattern formation during electrodeposition of copper-antimony alloys. Journal of Electrochemical Science and Engineering, [S. l.], v. 6, n. 1, p. 105–111, 2016. DOI: 10.5599/jese.235. Disponível em: https://pub.iapchem.org/ojs/index.php/JESE/article/view/235. Acesso em: 6 may. 2026.