In-depth component distribution in electrodeposited alloys and multilayers

Authors

  • László Péter Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Kálmán Vad Institute of Nuclear Research of the Hungarian Academy of Sciences, Bem tér 18/c, 4026 Debrecen
  • Attila Csik Institute of Nuclear Research of the Hungarian Academy of Sciences, Bem tér 18/c, 4026 Debrecen
  • Rocío Muñíz Department of Physical and Analytical Chemistry, University of Oviedo, Julián Clavería 8, 33006 Oviedo
  • Lara Lobo Department of Physical and Analytical Chemistry, University of Oviedo, Julián Clavería 8, 33006 Oviedo
  • Rosario Pereiro Department of Physical and Analytical Chemistry, University of Oviedo, Julián Clavería 8, 33006 Oviedo
  • SaÅ¡o Å turm Josef Stefan Institute, Ljubljana, Slovenia
  • Kristina Žužek Rožman Josef Stefan Institute, Ljubljana, Slovenia
  • György Molnár Institute of Technical Physics and Materials Science, Centre for Energy Research, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Katalin Németh Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Katalin Neuróhr Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Krisztina Boros Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Lajos Pogány Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest
  • Imre Bakonyi Wigner Research Centre for Physics, Hungarian Academy of Sciences, Konkoly-Thege út 29-33, 1121 Budapest

DOI:

https://doi.org/10.5599/jese.480

Keywords:

Alloy formation, near-substrate composition modulation, hydrodynamic conditions, component distribution correlations

Abstract

It is shown in this overview that modern composition depth profiling methods like secondary neutral mass spectroscopy (SNMS) and glow-discharge – time-of-flight mass spectrometry (GD-ToFMS) can be used to gain highly specific composition depth profile information on electrodeposited alloys. In some cases, cross-sectional transmission electron microscopy was also used for gaining complementary information; nevertheless, the basic component distribution derived with each method exhibited the same basic features. When applying the reverse sputtering direction to SNMS analysis, the near-substrate composition evolution can be revealed with unprecedented precision. Results are presented for several specific cases of electrodeposited alloys and mulitlayers. It is shown that upon d.c. plating from an unstirred solution, the preferentially deposited metal accumulates in the near-substrate zone, and the steady-state alloy composition sets in at about 150-200 nm deposit thickness only. If there is more than one preferentially deposited metal in the alloy, the accumulation zones of these metals occur in the order of the deposition preference. This accumulation zone can be eliminated by well-controlled hydrodynamic conditions (like the application of rotating disc electrodes) or by pulse plating where the systematic decrease in the duty cycle provides a gradual transition from a graded to a uniform composition depth profile. The application of composition depth profile measurements enabled detecting the coincidence in the occurrence of some components in the deposits down to the impurity level. This was exemplified by the GD-ToFMS measurements of Ni-Cu/Cu multilayers where all detected impurities accumulated in the Cu layer. The wealth of information obtained by these methods provides a much more detailed picture than the results normally obtained with bulk analysis through conventional integral depth profiling and help in the elucidation of the side reactions taking place during the plating processes.

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References

G. Hodes (ed.), Electrochemistry of Nanomaterials, Wiley-VCH, Weinheim, 2001 DOI: https://doi.org/10.1002/9783527612789

T. Watanabe, Nano-Plating. Microstructure Control Theory of Plated Film and Data base of Plated Film Microstructure. Elsevier, Amsterdam, 2004 DOI: https://doi.org/10.1016/B978-008044375-1/50010-5

Y. Lin Y, H. S. Nalwa (eds), Handbook of Electrochemical Nanotechnology, American Scientific Publishers, Valencia, CA, USA, 2009

T. Osaka, M. Datta, Y. Shacham-Diamand (eds), Electrochemical Nanotechnologies, Springer, New York, 2010 DOI: https://doi.org/10.1007/978-1-4419-1424-8

D. Wei (ed), Electrochemical Nanofabrication, Pan Stanford Publishing, Singapore, 2012

Aliofkhazraei M (ed), Modern Electrochemical Methods in Nano, Surface and Corrosion Science, InTech, Rijeka, Croatia, 2014 DOI: https://doi.org/10.5772/57202

M.V. Mirkin, S. Amenia, Nanoelectrochemistry, CRC Press, Boca Raton, Florida, USA, 2015

M. Aliofkhazraei, A.S.H. Makhlouf (eds), Handbook of Nanoelectrochemistry. Springer International Publishing, Cham, Switzerland, 2016 DOI: https://doi.org/10.1007/978-3-319-15207-3

F. Nasirpouri, Electrodeposition of Nanostructured Materials, Springer International Publishing, Cham, Switzerland, 2017 DOI: https://doi.org/10.1007/978-3-319-44920-3

G. H. Cockett, E. S. Spencer-Timms, Journal of the Electrochemical Society 108 (1961) 906-908 DOI: https://doi.org/10.1149/1.2428248

W. D. Doyle, Journal of Applied Physics 38 (1967) 1441-1142 DOI: https://doi.org/10.1063/1.1709657

R. Girard, Journal of Applied Physics 38 (1967) 1423-1430 DOI: https://doi.org/10.1063/1.1709651

E. Beltowska-Lehman, A. Riesekampf, Thin Solid Films 71 (1980) 129-132 DOI: https://doi.org/10.1016/0040-6090(80)90191-1

J. Gong, S. Riemer, A. Morrone, V. Venkatasamy, M. Kautzky, I. Tabakovic, Journal of the Electrochemical Society 159 (2012) D447-D454 DOI: https://doi.org/10.1149/2.082207jes

L. Péter, J. Pádár, E. Tóth-Kádár, Á. Cziráki, P. Sóki, L. Pogány, I. Bakonyi, Electrochimica Acta 52 (2007) 3813-3821 DOI: https://doi.org/10.1016/j.electacta.2006.10.058

V. Weihnacht, L. Péter, J. Tóth, J. Pádár, Z. Kerner, C.M. Schneider, I. Bakonyi, Journal of The Electrochemical Society 150 (2003) C507-C515 DOI: https://doi.org/10.1149/1.1583716

A. Bartók, A. Csik, K. Vad, G. Molnár, E. Tóth-Kádár, L. Péter, Journal of the Electrochemical Society 156 (2009) D253-D260 DOI: https://doi.org/10.1149/1.3133182

L. Péter, A. Csik, K. Vad, E. Tóth-Kádár, Á. Pekker, G. Molnár, Electrochimica Acta 55 (2010) 4734-4741 DOI: https://doi.org/10.1016/j.electacta.2010.03.075

K. Neuróhr, A. Csik, K. Vad, A. Bartók, G. Molnár, L. Péter, Journal of Solid State Electrochemistry 15 (2011) 2523-2544 DOI: https://doi.org/10.1007/s10008-011-1465-x

K. Neuróhr, A. Csik, K. Vad, G. Molnár, I. Bakonyi, L. Péter, Electrochimica Acta 103 (2013) 179-187 DOI: https://doi.org/10.1016/j.electacta.2013.04.063

R. Muñiz, L. Lobo, K. Németh, L. Péter, R. Pereiro, Spectrochimica Acta Part B 135 (2017) 34-41 DOI: https://doi.org/10.1016/j.sab.2017.06.016

S. S. Abd El Rehim, S. M. Abe-El Wahaab, O. M. Abdella, Surface Technology 21 (1984) 245-253 DOI: https://doi.org/10.1016/0376-4583(84)90086-4

V. D. Jović, N. Tošić, Journal of Electroanalytical Chemistry 441 (1998) 69-76 DOI: https://doi.org/10.1016/S0022-0728(97)00199-X

A. C. Hegde,V. R. Rao, Journal for Electrochemistry and Plating Technology, May 2014, paper 3300 (available at https://www.jept.de/?p=3300; DOI: 10.12850/ISSN2196-0267.JEPT3300

H. J. Goldschmidt, M. J. Walker, Journal of Applied Crystallography 2 (1969) 273-281 DOI: https://doi.org/10.1107/S0021889869007205

F. A. Shunk, P. Nash, Journal of Phase Equilibra 8 (1987) 122-124 DOI: https://doi.org/10.1007/BF02873195

P. P. Jana, S. Lidin, CrystEngComm 15 (2013) 745-753. DOI: https://doi.org/10.1039/c3ce27075k

A. Brenner, Electrodeposition of Alloys, Academic Press, New York, 1963, Chapter 5., pp. 75-78, DOI: https://doi.org/10.1016/B978-1-4831-9808-8.50012-5

H. Li, F. Ebrahimi, Materials Science and Engineering A 347 (2003) 93-101 DOI: https://doi.org/10.1016/S0921-5093(02)00586-5

N. Zech, E.J. Podlaha, D. Landolt, Journal of the Electrochemical Society 146 (1999) 2886-2891 DOI: https://doi.org/10.1149/1.1392024

N. Zech, E.J. Podlaha, D. Landolt, Journal of the Electrochemical Society 146 (1999) 2892-2900 DOI: https://doi.org/10.1149/1.1392025

K. Sasaki, J.B. Talbot, Journal of the Electrochemical Society 142 (1995) 775-782 DOI: https://doi.org/10.1149/1.2048534

J. Vaes, J. Fransaer, J.P. Celis, Journal of the Electrochemical Society 149 (2002) C567-C572 DOI: https://doi.org/10.1149/1.1511189

Y. Zhuang, E. J. Podlaha, Journal of the Electrochemical Society 147 (2000) 2231-2236 DOI: https://doi.org/10.1149/1.1393512

Y. Zhuang, E. J. Podlaha, Journal of the Electrochemical Society 150 (2003) C219-C224 DOI: https://doi.org/10.1149/1.1554916

Y. Zhuang, E. J. Podlaha, Journal of the Electrochemical Society 150 (2003) C225-C233 DOI: https://doi.org/10.1149/1.1554917

A. Csik, K. Vad , E. Tóth-Kádár, L. Péter, Electrochemistry Communications 11 (2009) 1289-1291 DOI: https://doi.org/10.1016/j.elecom.2009.04.027

X. Liu, G. Zangari, L. Shen, Journal of Applied Phisics 87 (2000) 5410-5412 DOI: https://doi.org/10.1063/1.373359

Y. Zhang, D. G. Ivey, Chemistry of Materials 16 (2004) 1189-1194 DOI: https://doi.org/10.1021/cm035306u

Y. Zhang, D. G. Ivey, Materials Science and Engineering B 140 (2007) 15-22 DOI: https://doi.org/10.1016/j.mseb.2007.03.004

X. Liu, G. Zangari, M. Shamsuzzoha, Journal of the Electrochemical Society 150 (2003) C159-C168 DOI: https://doi.org/10.1149/1.1545462

F.E. Atalay, H. Kaya, S. Atalay, Physica B 371 (2006) 327-331 DOI: https://doi.org/10.1016/j.physb.2005.10.126

Y. Yang, International Journal of Electrochemical Science 10 (2015) 5164-5175 DOI: https://doi.org/10.1016/S1452-3981(23)06694-4

T. Nakanishi, M. Ozaki, H. S. Nam, T. Yokoshima, T. Osaka, Journal of the Electrochemical Society 148 (2001) C627-C631 DOI: https://doi.org/10.1149/1.1388886

M. Saito, N. Ishiwata, K. Ohashi, Journal of the Electrochemical Society 149 (2002) C642-C647 DOI: https://doi.org/10.1149/1.1518483

I. Tabakovich, V. Inturi, S. Riemer, Journal of the Electrochemical Society 149 (2002) C18-C22 DOI: https://doi.org/10.1149/1.1421346

R. Caballero-Flores, V. Franco, A. Conde, L. F. Kiss, L. Péter, I. Bakonyi, Journal of Nanoscience and Nanotechnology 12 (2012) 7432-7436 DOI: https://doi.org/10.1166/jnn.2012.6521

Published

03-03-2018

Issue

Section

6th RSE SEE Special Issue

How to Cite

In-depth component distribution in electrodeposited alloys and multilayers. (2018). Journal of Electrochemical Science and Engineering, 8(1), 49-71. https://doi.org/10.5599/jese.480